Microscopic analysis technology

In order to meet the increasingly stringent cleanliness requirements associated with the miniaturization of semiconductors, we are building a system capable of multifaceted analysis (both inorganic and organic).

Design with 3D CAD

We perform basic structural analysis and design seamlessly, leading to faster product design and proposals.

Test equipment for semiconductor and liquid crystal manufacturing devices

To evaluate performance under severe operating conditions in the semiconductor market, we have thermal cycle test equipment capable of cycling through high and low temperatures.

Data collection and analysis test equipment for failure prediction

This test equipment is used to collect and analyze data on pressure, temperature, torque, vibration, etc. under operating conditions, including failure modes, in order to establish technology for predicting mechanical seal failures.

Low temperature test equipment for valves

This test equipment is used to collect data on sealing characteristics, sliding characteristics, and stress relaxation characteristics of gland packing for valves in low temperature environments (-150 to 0°C). It is utilized for the development of gland packing suitable for low temperature environments.

Friction and abrasion tester

This tester is used for technical evaluation of sliding friction and abrasion characteristics between the material to be evaluated and the mating material to be used for sealing materials. Both ring-on-ring and pin-on-disk testing are possible.